The chipmakers use many technical terms in their day to day work, but in abbreviated forms. Beginners find it difficult to get along with these abbreviations unlike others. The Saint gathered and created a glossary of many acronyms that are frequently used in IC design industry.
The chipmakers use many technical terms in their day to day work, but in abbreviated forms. Beginners find it difficult to get along with these abbreviations unlike others. The Saint gathered and created a glossary of many acronyms that are frequently used in IC design industry.
ALD
|
Atomic Layer Deposition
|
AOCV
|
Advanced On-Chip Variation
|
ASIC
|
Application-Specific Integrated Circuit
|
ATPG
|
Automatic Test Pattern Generation
|
BC
|
Best-Case
|
BEOL
|
Back-End-Of-Line
|
C4
|
Controlled Collapse Chip Connection
|
CAD
|
Computer-Aided Design
|
CDC
|
Clock Domain Crossing
|
CCS
|
Composite Current Source
|
CMP
|
Chemical Mechanical Planarization
|
CSP
|
Chip Scale Package
|
CTS
|
Clock Tree Synthesis
|
CVD
|
Chemical Vapor Deposition
|
DEF
|
Design Exchange Format
|
DFM
|
Design For Manufacturability
|
DFT
|
Design For Test
|
DRAM
|
Dynamic Random Access Memory
|
DRC
|
Design Rule Check
|
ECD
|
Electrochemical Deposition
|
ECO
|
Engineering Change Order
|
EDA
|
Electronic Design Automation
|
EM
|
Electromigration
|
ERC
|
Electrical Rule Check
|
ESD
|
Electro-Static Discharge
|
FEOL
|
Front-End-Of-Line
|
FPGA
|
Field Programmable Gate Array
|
GDSII
|
Graphic Database System II
|
HDL
|
Hardware Description Language
|
IC
|
Integrated Circuit
|
ILM
|
Interface Logic Model
|
LEC
|
Logic Equivalence Check
|
LEF
|
Library Exchange Format
|
LOCV
|
Location-based On-Chip Variation
|
LSI
|
Large-Scale Integration
|
LVS
|
Layout Versus Schematic
|
MBE
|
Molecular Beam Epitaxy
|
MSI
|
Medium-Scale Integration
|
MCMM
|
Multi-Corner Multi-Mode
|
NDR
|
Non-Default Rules
|
NLDM
|
Non-Linear Delay Model
|
OASIS
|
Open Artwork System Interchange Standard
|
OCV
|
On-Chip Variation
|
OPC
|
Optical Proximity Correction
|
PCB
|
Printed Circuit Board
|
PMU
|
Power Management Unit
|
PVD
|
Physical Vapor Deposition
|
PVT
|
Process Voltage Temperature
|
RAM
|
Random Access Memory
|
RDL
|
Re-Distribution Layer
|
ROM
|
Read Only Memory
|
RTA
|
Rapid Thermal Anneal
|
RTL
|
Register Transfer Level
|
SDC
|
Synopsys Design Constraint
|
SDF
|
Standard Delay Format
|
SI
|
Signal Integrity
|
SiP
|
System in Package
|
SoC
|
System on Chip
|
SPEF
|
Standard Parasitic Exchange Format
|
SPICE
|
Simulation Program with Integrated Circuit Emphasis
|
SSI
|
Small-Scale Integration
|
SSN
|
Simultaneous Switching Noise
|
STA
|
Static Timing Analysis
|
ULSI
|
Ultra-Large-Scale Integration
|
UPF
|
Unified Power Format
|
VHDL
|
VHSIC hardware description language
|
VHSIC
|
Very-High-Speed Integrated Circuits
|
VLSI
|
Very-Large-Scale Integration
|
WC
|
Worst-Case
|
P.S: Though significant efforts have been put in gathering all the possible acronyms, the saint could have still missed out some. If you can think of any, which are missing in the above list, please write to the saint so that he can update his list.
参考:
- http://siliconsaint.blogspot.com/2012/07/acronyms-in-asic-design_21.html